GaN possess bandgaps of 3.4 electronvolts (eV) respectively, while Si has a bandgap of 1.1eV. When you take into account the increase in transistor and IC performance combined with lower cost, GaN provides power design engineers several advantages:
Texas Instruments' LMG5200 80V GaN half-bridge power stage provides an integrated power stage solution featuring 15mΩ GaN FETs and driver. The device consists of two 80V GaN FETs driven by one high-frequency GaN FET driver in an half-bridge configuration. Additionally, TI's LMG3410R070 600V GaN power stage with integrated driver and protection enables designers to achieve new levels of power density and efficiency in power electronics systems.
It is also critically important to make an intelligent decision with your passive component selection. KEMET Electronics' KC-LINK ceramic capacitors and other passive components answer GaN's challenges of higher capacitance, higher power ratings and elevated temperatures, lower ESR, lower ESL and low-profile designs.
Gallium nitride (GaN) high-electron-mobility transistors (HEMTs) are replacing silicon metal-oxide semiconductor field-effect transistors (MOSFETs) and insulated-gate bipolar transistors (IGBTs) to power a new generation of efficient, high-voltage, and high-frequency electric motor inverters. Read More»